The Proceedings of Conference of Kanto Branch
Online ISSN : 2424-2691
ISSN-L : 2424-2691
2000.6
Session ID : 202
Conference information
202 The Example of Simulation of Temperature Profile on Intraformational Material with High Frequency Dielectric Heating
Junji KAMOSHIDAKouji ANZAIHiromi SAITHOMasahiro SEKINE
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

The exterior-heating of metal mold has been used for plastic of many thermoplastics resins as heating in processing so far. But, because the low thermal conductivities of the synthetic resin, plastic processing of the plank has been made difficult. So, this research proposed the method which made this give off heat uniformly from the internal of the material due to high frequency dielectric heating. The purpose of this research did the simulation analysis of unsteady state temperature distribution which isn't steady between the layers to process molding of the plastic resins due to high frequency dielectric heating.

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© 2000 The Japan Society of Mechanical Engineers
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