Abstract
AFM force-curve evaluation was performed for copper surface in CMP chemicals. Force-curve data reflect the mechanical properties of surface reaction layer. Force-curve data were transformed into force-indentaion curve data using SPIPTM software. Hertz contact model using Si AFM probe was applied to evaluate the mechanical property (Young's modulus) of surface reaction layer quantitatively. The Young's modulus of clear Cu surface was nearly 120GPa and that of Cu-BTA reaction layer was 30GPa. Cu-H_2O_2 layer 3GPa, respectively. The transformation from force-curve to the force-indentaion curve was required to evatuate the mechanical property of Cu surface for clarify and quantitatively.
