Abstract
We researched the dependences of film thickness distribution on CO_2 flow rate and temperature, using a one-dimensional flow-type reaction system, for supercritical fluid chemical deposition (SCFD) of Cu. It was found that the film thickness became thinner with the distance from the fluid inlet. This is because the Cu precursor is consumed and its density is decreased. When the flow rate was high, the deposition rate decreased near the inlet of the reactor because of the limitation of heat transfer from the reactor to the deposition ambient. Based on these results, we discussed the necessity of a pre-heating system and studied a possible reactor structure large-area deposition.
