Abstract
As the basic research for an electronic device bonding except for the high temperature and /or an impact force environments, the room temperature bonding experiments have been performed using low frequency vibration. As a results, The highest bonding strength was obtained in nitrogen gas atmosphere that was low oxygen condition. The bonding strength of Cu-Cu cuple shows the highest value in each cuples, Cu-Al cuplewas the second high value, and Al-Al couple was the lowest These results were thought that the cause of the activity of oxgin l)r aluminum. In addition, the bonding strengths represent the maximum value at a certain viblation amplitude for each cuoples. The viblation amplitude state showed the maximum bonding strength where the continuous contact area during vibration for specimens section area was approximately 37%.
