The Proceedings of Conference of Kyushu Branch
Online ISSN : 2424-2780
2000.53
Conference information
612 Application of Moire Interferometry to Thermal Deformation of IC Packages
Kazuo ARAKAWA, Mitsugu TODO, Shinji YAMADA, Kiyoshi TAKAHASHI
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 187-188

Details
Download PDF (455K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2000 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top