Abstract
Direct micro joining with YAG laser beams between copper wire and plate or substrate board was carried out. A contact angle between wire and plate affected peeling strength greatly. And an effect of pulse control was also great and it was good work for control of wire melt behavior. In cases of plate of 200μm and 100μm in thickness, high peeling strength of 4N with little dispersion was obtained in pulse control condition. However, in case of copper substrate board of 70μm in thickness, the strength was poor. Because of few thermal capacity, thermal conditions tended to be changed sensitively by conditions such as contact angle, surface state of wire, accuracy of wire setup and so on.
