Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2009.5
Session ID : A17
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A17 Influence of Nanoimprinting Pressure on Mechanical Damage in Compound Semiconductor Substrate Used for Laser Diode(M4 processes and micro-manufacturing for science)
Masaki YANAGISAWAYukihiro TSUJIHiroyuki YOSHINAGAKenji HIRATSUKAJun TANIGUCHI
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Abstract
When nanoimprint lithography (NIL) is used for compound semiconductor, mechanical damage caused by imprinting pressure is a critical issue in view of device characteristics and its reliability. We demonstrate that no evident damage have been caused by imprinting in our process by using photoluminescence method and simulations. We also indicate that fabricated laser diodes show comparable characteristics and reliability with those fabricated by conventional electron-beam lithography process. NIL is substantially applicable to fabrication of compound semiconductor devices such as laser diodes.
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© 2009 The Japan Society of Mechanical Engineers
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