Abstract
This paper describes with the cutting properties of LiNbO_3 wafer in the direct cutting of micro flow channel for the fabrication of micro pump device driven by surface acoustic wave (SAW) in μ-TAS. The surface integrity of the micro channel finished by micro end milling and the ultra-precision diamond cutting is evaluated under the variety of the cutting conditions and the crystal orientation of work material. The surface integrity extremely depends on the crystal orientation. The surface roughness in micro end milling is ranged from 3μm to 5μm Rz and is improved to approximately 1/10 in the diamond cutting.
