Abstract
The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.
