B032 Development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers

Yoshiaki TASHIRO; Libo ZHOU; Jun SHIMIZU; Noriaki SHINODA; Yoshinori MITSUI

doi:10.1299/jsmelem.2013.7.298

2013.7

Session ID : B032

DOI https://doi.org/10.1299/jsmelem.2013.7.298

Conference information

B032 Development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers

Yoshiaki TASHIRO, Libo ZHOU, Jun SHIMIZU, Noriaki SHINODA, Yoshinori MITSUI

Author information

Keywords: sapphire wafer, constant pressure condition, diamond pellet wheel, fixed abrasive, removal rate

CONFERENCE PROCEEDINGS FREE ACCESS

Details

Abstract

Free abrasive machining has been widely used for the finishing of mono-crystallined sapphire wafers. There are, however, critical issues remaining, such as degradation of flatness due to the nature of pressure controlled in-feed dynamics, environmental load due to disposal of wasted slurry, and time/cost consuming. Fixed abrasive machining is one of the potential alternatives to make a breakthrough to such problems. This study aims to development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers.

Corresponding author

Register with J-STAGE for free!