Abstract
The demands for manufacturing thin silicon wafers have increased following the advancements in technology. To increase product efficiency and accuracy of semiconductors, a new method for holding the silicon wafer is required. An electro-adhesive gel (EAG) is a new material developed as a functional material applied to hold the devices. The EAG can change its surface adhesion properties depending on the applied electric field. Based on the structure of the EAG, a new function that can change its thermal conductivity is developed. The new function is expected to enable quicker cooling of the wafer, leading to a more efficient manufacturing process. From the experiment the EAG can change its thermal conductivity for about 20%.
