Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
2013.7
Session ID : A021
Conference information
A021 Experimental investigation of material removal mechanism in ultrasonic assisted grinding of SiC ceramics using a single diamond tool
Jianguo CaoYongbo WuHuiru GuoMasakazu FujimotoNomura Mitsuyoshi
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
To expose the material removal mechanism in ultrasonic assisted grinding (UAG) of SiC ceramics, the deformation features of SiC ceramics in ultrasonic assisted scratching (UAS) tests were investigated and compared with those in conventional scratching (CS). The results revealed that the scratching force varies periodically and the scratching trace appears to be sinusoidal in UAS. It was also found that the scratching groove generated in CAS is deeper than that in CS and the sizes of lateral cracks are increased owing to the impact of the tool generated in UAS process.
Content from these authors
© 2013 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top