Abstract
In machining of Si wafer, high efficiency and high precision processing is demanded. This paper presents the high efficiency mirror finishing of Si wafer using chemical-mechanical machining of fixed abrasive assisted ultrasonic vibration. Ultrasonic chemical-mechanical machining system has been designed and machining experiments have been carried out to clarify fundamental machining properties of proposed method. As a result, the working life of the abrasive pellet becomes longer by suppressing the loading with the ultrasonic vibration; the polishing chip becomes small when ultrasonic vibration is applied. From these results, it is shown that made of defect-free mirror surface is easily compared with traditional chemical-mechanical grinding method.
