Fatigue Life Design for Micro-Solder Joints between Semiconductor Devices and Circuit Board : Thermal Fatigue in Solder Material

Journal of the Society of Mechanical Engineers

Online ISSN : 2424-2675
ISSN-L : 0021-4728

Fatigue Life Design for Micro-Solder Joints between Semiconductor Devices and Circuit Board : Thermal Fatigue in Solder Material

Takashi Kawakami

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1995 Volume 98 Issue 925 Pages 981-985

DOI https://doi.org/10.1299/jsmemag.98.925_981

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© 1995 The Japan Society of Mechanical Engineers

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