The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2011
Session ID : G030084
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G030084 Fabrication of high density Cu nanowire array by template method and its evaluation
Yuka IWASAKIYang JUYasuyuki MORITAAtsushi HOSOI
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Abstract
Characteristic of nanowire is gradually attracting many researchers with potential applications of nano devices, nano sensors, solar sells and so on. This paper describes fabrication and evaluation of high density Cu nanowire array grown in porous aluminum. To fabricate high density nanowire array, at first Ta and Cu films were evaporated on one side of Si wafer as a conductive working electrode. Nanowire array was formed via electrical deposition in copper sulfate aqueous solution. After etching in 2 M NaOH aqueous solution to remove porous aluminum, we obtained high density nanowire array on Si wafer perpendicular to its surface. High density Cu nanowires with average diameter of 200 nm, approximately, were observed by scanning electron microscope. In order to understand performances of Cu nanowire array, electrical and mechanical properties of them were studied in details.
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© 2011 The Japan Society of Mechanical Engineers
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