The use of adhesive bonding has recently been expanding to join metal panels. However, pre-curved metal adherends can cause residual stress, and it leads to the fracture of the joints, especially at high temperature caused in paint baking process for instance. The purpose of this study is to establish a method for predicting the fracture phenomena of joints bonded with a second generation acrylic adhesive (SGA) at high temperature. The stress-strain curves of the adhesive at various temperatures were measured experimentally. The debonding process of the joints, which had pre-curved adherends having constant curvatures, was also investigated experimentally. The deformation of the adhesive layer was predicted analytically using Dillard's model and finite element method. The debonding temperature was also predicted based on the stress-strain curves and the analytical results. The predictions showed fairly goof agreements with the experimental results.
