Abstract
Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited, since lead may have a bad influence on human and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that of SnPb, which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The results indicate that the flux has the effects to shorten the heating time and control the substrate temperature.
