The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2011
Session ID : S054072
Conference information
S054072 Development of measurement system for wall temperature with Temperature Sensitive Paint
Jumpei KITAYAMATakashi KUBOOsamu TERASHIMA
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Abstract
Thermocouple and infrared thermography have been widely used to measure a temperature. However thermocouple is only one point measurement, and infrared thrmography cannot use through infrared impermeable material such as water or acrylic board. In order to solve these problems, we have developed a temperature measurement system by using temperature sensitive paint (TSP). TSP is a kind of luminescent paint and its luminescent intensity decreases with increasing temperature. Utilizing temperature dependency of TSP, planar temperature distribution can be measured from an image of luminescent intensity. TSP is composed of luminescent molecule, binder, and solvent. In the present study, Ru(phen)32+ is adopted as luminescent molecule, and blue LED is used to excite the molecule. To evaluate the present measurement system, temperature distributions of wall jet and impinging jet are measured.
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© 2011 The Japan Society of Mechanical Engineers
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