The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2012
Session ID : J043044
Conference information
J043044 Improvement of the bonding force of abrasive grains in Cu-based Diamond grinding wheel by addition of Ti
Hisashi SatoYuuta MAMIYAYoshimi WATANABE
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Carbon fiber reinforced plastic (CFRP) is used as material for automobile and aircraft. However, it is difficult to work the CFRP due to its too high strjpnth. As drilling process for CFRP, gyro-driving drilling machine has been proposed. Although this drilling machine makes hole in CFRP plate by using grinding wheel, high strjpnth is required for the grinding wheel. Recently, in order to achieve this requirement, Cu-based diamond grinding wheel has been successfully fabricated by centrifugal mixed-powder method. This grinding wheel can make holes for CFRP without delamination and burr, but then the bonding force between Cu matrix and a diamond particle is low. This is because wettability between Cu and diamond is low. In this study, the Cu-based grinding wheels with Cu-Ti matrix have been fabricated. As results, it is found that the addition of Ti into Cu matrix is effective to enhance the bonding force and wear resistance of the Cu-based grinding wheel.
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© 2012 The Japan Society of Mechanical Engineers
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