Abstract
We fabricated un-tapered, high precision silicon microstructures using silicon dry etching technology in order to obtain narrow pitch Si imprint mold for X-ray diffraction gratings. Si dry etching technique makes it possible to fabricate high aspect ratio rectangular microstructures. Therefore, this technique is expected to make high precision narrow pitch grating pattern. In this paper, we try to fabricate a narrow pitch of 1.2 (μm, and a depth of about 5 μm. From these results, we proposed the new low cost fabrication process for narrow pitch silicon mold using ICP-RIE and nano-imprint technologies. And, m order to form transparence imprint mold, we used thermal oxidation of Si mold. This method is very simple. Optical imprint method was confirmed that the mass production of micro and nano pattern was possible; however, this expriment is under conditions. These demonstrations of thermal oxidation are promising method for high precision transparence imprint mold with low cost, and realized low cost optical devices.
