Abstract
A lot of semiconductor packages are used for electronic parts in telecommunication equipment. Semiconductor packages are made of different kinds of material which form multilayer laminate in structure. The warp has developed difference of physical properties of material. Thermosetting-resin of epoxy resin is mainly used for the encapsulant of semiconductor package. In this report, warp has developed noteworthy by cooling process and layer structure. The model is simple two-layer-laminated structure, which is the subject of an experiment in an epoxy resin/steel. These laminated structures heat at constant temperature of 180℃, and a chain of thermal loading until cooling is given. As a result, the theory is possible to estimate warp deformation of laminated structure.
