The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2013
Session ID : J045092
Conference information
J045092 Measurement of Cure Index, Voids and Strain of GFRP Laminates During Molding
Takuya KAJIKAWATatsuro KOSAKAKazuhiro KUSUKAWA
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Abstract
In the present study, we propose a system for monitoring cure process of FRP prepregs during hot-press molding using dual light sources, FBG sensors and refractive-index sensors. The optical system is composed of a 1310 nm narrow-band FP-LD light, a 1510nm broad-band SLD light, 1300/1500 WDM couplers, a spectrum recorder and an optical power meter. The FBG sensors have a distal end at which Fresnel's reflection between glass and resin occurs. The reflected 1310nm light form the distal end and the FBG reflection (about 1550nm) were divided into two individual paths by a WDM coupler. The power of 1310nm light was measured by an optical power meter and used for calculating refractive index of matrix resin. Spectra of the FBG light were recorded by a spectrum analyzer. In this study, GFRP prepregs were used for the experiments. From the results in the present paper, it was found that the our monitoring system could monitor not only strain and cure index but also voids generation and resin flow.
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© 2013 The Japan Society of Mechanical Engineers
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