[volume title in Japanese]
Session ID : J0120103
Conference information
Host: The Japan Society of Mechanical Engineers
Name : Mechanical Engineering Congress,Japan
Date : September 11, 2016 - September 14, 2016
Numerical simulations of thermo-fluid process in dip soldering
Yuki SHIOHARA, Shinji NAKAGAWA, Tomoyuki HATAKEYAMA, Koichi ISHIKURA, Katsuhiro KOIZUMI
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