Host: The Japan Society of Mechanical Engineers
Name : Mechanical Engineering Congress,Japan
Date : September 11, 2016 - September 14, 2016
Power devices are used for resent cars, trains, electric supply system and so on. They are one of the key technologies for saving energy and reducing carbon oxide. Power devises used to be encapsulated in soft gel. However, the encapsulation material is changing to molding resin due to the low cost and higher reliability. Because the power devices in next generation will be used under the temperature higher than 200 °C, the delamination of the molding resin due to thermal stress is the problem to solve. It is important to evaluate the reliability of the delamination between the molding resin and a print circuit substrate in power devices. We will provide the evaluation technique of the delamination reliability of the molding resin.
