The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
[volume title in Japanese]
Session ID : S1120104
Conference information

Development of Wire and Rigid Links Hybrid Parallel Mechanism for Haptic Devices
Ryosuke KOBAYASHIMasaru HIGUCHI
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract

In this report, a novel 3-USR parallel mechanism with large work space for haptic devices is designed. To realize high structural transparency, these joints are composed of 2 D.O.F. spherical parallel mechanisms. The spherical parallel mechanism is composed of 2 rigid links (output link and stationary link) and three wires. The output link is connected stationary link by universal joint and is driven by three wires. In order to realize large work space, center points of three universal joints must be placed in condition that their center points are coincident. To realize large work space of the triple universal joint, its structures and kinetic characteristics are investigated and compared. Besides, based on this result, a prototype of the universal joint to connect wires and rigid link is designed.

Content from these authors
© 2016 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top