Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 03, 2017 - September 06, 2017
A highly reliable joint structure, composed of a “nano-spring” layer, for a power-semiconductor device was developed. The nano-spring layer is a structure composed of multiple nanoscale springs made by the glancing angle deposition method. In the case of the developed structure, the die has a nano-spring layer on its surface and that layer is bonded to a metallic circuit by soldering. Thermal stress in the structure is reduced because the nano-spring layer absorbs the difference between the thermal deformations of the die and the metallic circuit.
