Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 03, 2017 - September 06, 2017
Mobile devices are becoming more functional, thinner and having waterproof function. Therefore, heat is easily stored inside a mobile device. As a solution to the problem, heat conduction sheet was developed, but its heat diffusion effect is not sure. In this situation, simple analysis model was proposed for heat conduction sheet. In this report, cooling characteristics of heat conduction sheet were investigated experimentally, and validity of numerical prediction using the simple analysis model was verified.