Study of Reduction of Thermal Resistance in High-Heat-Generating Electronics

Abstract

This paper describes the evaluation of relationship between thermal contact resistance and load with 3 types of TIM (Thermal Interface Materials), and the evaluation of performance of heat spreader. Experimental study was conducted for evaluation of thermal contact resistance, and the conditions of bare contact surface and TIM (copper paste and solder) in between were evaluated. For detection of spread angle in heat spreader, thermal analysis is performed. Experimental results showed contact thermal resistance with solder in between was lowest thermal contact resistance, and the resistance was not dependent on contact pressure. Numerical results showed that the spread angle is less than 45°, when the thickness of the heat spreader is 3 [mm].