The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
[volume title in Japanese]
Session ID : S0410103
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Direct writing of Cu mesh electrodes on flexible substrates using femtosecond laser reductive sintering of CuO nanoparticles
*Mizue MIZOSHIRIYasuaki ITOJunpei SAKURAISeiichi HATA
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

Cu-based mesh electrodes were directly written using femtosecond laser reductive sintering of CuO nanoparticles. CuO nanoparticle solution containing CuO nanoparticle, polyvynilpyrrolidone, and ethylene glycol was spray-coated on flexible poly(dimethylsiloxane) substrates. Femtosecond laser pulses were focused onto the CuO nanoparticle solution using an objective lens with a numerical aperture of 0.45 in air. When the scan pitch for mesh patterning was more than 25 μm, Cu-rich mesh patterns were formed. The Cu-mesh temperature sensors were fabricated at the scan pitch of 50 μm. The temperature coefficient of the sensor was +0.004, which is consistent with the Cu bulk one. This fabrication process is useful for additive manufacturing on flexible and nonplanar surfaces.

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© 2018 The Japan Society of Mechanical Engineers
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