Effects of Pressure Drop Characteristic due to Branching and Confluence on Development of Flow and Thermal Resistance Network Model of Finned Heat Sinks with Bypass

Abstract

This study describes thermal design method of forced convection cooling in high-density packaging electronic equipment using flow and thermal resistance network analysis. Forced convection cooling by the combinations of fans and heat sinks are widely used in lots of electronic equipment. However, in recent high-density packaging electronic equipment, enough clearance which airflow can be generated cannot be prepared and the airflow around the heat sinks becomes complex. In this study, a development of a function model of finned heat sinks mounted in high-density packaging electronic equipment with bypass by using the flow and thermal resistance network analysis. Especially, this paper tried to predict a balance of the supply flow rate between the heat sink and the bypass on the heat sink by obtaining information about pressure drop characteristics of the branch and the confluence around the heat sink.