The Proceedings of Mechanical Engineering Congress, Japan
Online ISSN : 2424-2667
ISSN-L : 2424-2667
2022
Session ID : J043-16
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Development of a Direct Bonding Method Using a Laser to Suppress the Compounding of Copper and Aluminum
*Ryo OKAWARAKeisuke NAGATOZhenglong FANGKazuya MATSUDAMasayuki NAKAO
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Abstract

Recently, there has been a movement to replace copper with aluminum for wiring from a carbon-neutral perspective. Therefore, laser welding, which can join metals at high speed, is expected to be used for this purpose. However, the copper-aluminum intermetallic compounds resulting from the long melting time at high temperatures are brittle. On the other hand, nickel plating is generally used to prevent corrosion. This study investigated the usefulness of laser welding of nickel-plated copper and aluminum. Elemental analysis and heat transfer analysis of the weld surface showed that nickel is advantageous in suppressing compounds and the interface temperature conditions at which compounds are suppressed. In addition, tensile tests confirmed that the suppression of compounds increases strength.

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© 2022 The Japan Society of Mechanical Engineers
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