Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 11, 2022 - September 14, 2022
Against the background of growing needs for super engineering plastics in CFRTP molding, we verified the effect of Si-DLC on reducing the peel-off strength between molded resin and mold surface. In particular, we focused on whether or not a sufficiently low peel-off strength could be achieved without using a mold release agent by applying Si-DLC to the surface where PEEK material is melted and solidified. The PEEK specimen is given a melting-solidification temperature history on three types of metals or DLC films (SUJ2, Si-DLC, ta-C), and the adhesion interface is peeled off at a peeling temperature after solidification. In SUJ2, the peel-off strength increased monotonically from 8.10 to 21.09 MPa as the peeling temperature increased from 30 °C to 130 °C, which is near the glass transition temperature of PEEK. When Si-DLC was applied, the peeloff strength was not smaller than that of SUJ2.
