Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 03, 2023 - September 06, 2023
In this study, thermal induced flow around a set of rectangular blocks modeled from stepped Al-Ga-As / Ga-As-Si semiconductors set in a microchannel is simulated by solving the Navier-Stokes equation with velocity slip and temperature jump conditions on the wall. The surface temperature on one side of each rectangular block was set higher than that on the other. The simulation results suggest that the pressure increases from low temperature surface to high temperature surface of rectangular blocks stepwise and that the computational model plays the role of a pump by generating thermal induced flow around each block.
