Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 03, 2023 - September 06, 2023
In recent years, microfluidic devices have attracted attention in various fields of research. However, its gas permeability is subject to external heating and chemical reaction heat. This leads to bubble formation and blockage of microfluidic channels. We focused on microfluidic devices using polymethyl methacrylate (PMMA), which has high light permeability and gas tightness among polymer resins. We have applied the diffusion bonding technique, which is mainly used for bonding homogeneous metals, to polymer resins and have succeeded in bonding two base materials without deformation. The best maximum temperature for bonding was found to be 100°C. It was also confirmed that the smoothness of the bonding surface has a significant effect on the bonding results. This research aims to mass-produce flexible microfluidic devices using polymethyl methacrylate (PMMA) film. methacrylate (PMMA), which has good light permeability and gas-tightness, for use as heat exchangers, and to establish diffusion bonding as a sealing technology for these devices.
