Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 03, 2023 - September 06, 2023
This study proposes a new method for generating silicon substrates with a thickness of less than 100 μm using surface tension and electromagnetic pressure. The authors had previously conducted experiments to generate substrates by applying electromagnetic pressure, but the thickness did not reach the target of 100 μm. In order to solve the problem for the thickness reduction, the shape of the crucible was changed in the substrate generation experiments, and the thickness was successfully reduced to less than 100 μm in some region of the substrate made. In addition, to achieve effective application of electromagnetic pressure, the theoretical formula for electromagnetic pressure used in the previous study was modified, and an evaluation formula was devised to match the authors，experimental system.
