Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 08, 2024 - September 11, 2024
This paper discusses inductively coupled plasma discharge which is widely used in semiconductor fabrication processes, from view point of numerical evaluation. Three-dimensional asymmetric simulation is performed using COMSOL MultiphysicsⓇ. Mixture gas of Ar/CH4 is introduced as a reaction gas. Two different modelling methods for coil are investigated. It is shown that modelling the coil as a boundary type is an optimized method, comparing to model the coil as a domain type.