Applications of Inelastic Analysis to the Fatigue Design on Solder Joints

Abstract

Fatigue life estimation of solder joints is one of the most critical technologies for the development of electronics devices. The combination of inelastic stress analysis and low cycle fatigue concept are very useful to predict the life of solder joints. In this report, applications of this method for BGA with 63Sn-37Pb solder bumps are introduced.