Abstract
In three-dimensional joints, stress concentration is generated by the difference of material properties at the interface edge, and the generation of cracks and strength degradation may be caused. In this study, stress singularity for the bonded structures of metal and ceramics observed frequently in electronic components is analyzed considering thermal strain. And the eigenvalue analysis based on the formulation of finite element method is used for calculating the order of stress singularity. Concretely, thermal displacement and thermal stress distribution near the stress singular field is investigated in the three-dimensional bonded structure for uniform temperature change.
