Dynamic characteristics of diaphragm microactuators utilizing sputter-deposited Ti-Ni shape memory alloy thin films

Abstract

Diaphragm type microactuators utilizing Ti-Ni thin films sputter-deposited on a Si wafer were fabricated by the photolithography method. The dynamic behavior of the actuators were characterized by measuring the movement of the actuators during heating and cooling. The temperature variation was achieved by sending or cutting off electric current alternatively. The displacement of the movement depended on the electric current, the switching ratio of the electric current and frequency of the actuation.