Pages 457-458
This paper deals with powder forming behavior of ground chips which discharged while ball bearings are manufacturing. The ground chips are investigated whether it is possible to use as P/M raw material used for mechinary parts. Two kind of sintering processes were used, that is Spark Plasma Sintering (SPS) and Vacuum Sintering (VS). The density for SPS materials was higher than that for VS materials. In addition, the bending strength for SPS materials with high density was extremely high. We can conclude that the SPS is a suitable powder forming method for ground chips.