Development of Core Technologies for φ 300mm Silicon Wafer Grinding

Abstract

This research project has successfully developed a one-stop manufacturing system, using fixed abrasive grinding wheel instead of free sully, to provide a totally integrated environment for φ300mm silicon wafer manufacturing to achieve the surface integrity equal to or better than the current lapping, etching and polishing processes. The key component developed for this system is the giant magnetostrictive actuator, which is used to precisely position the grinding head against the workpiece for non-defect grinding. With the closed-loop feedback control, the actuator is able to move half a ton of payload at the resolution of 6.25Å. The first trail test has shown the result of surface roughness Ra less than 1nm and global flatness less than 0.2μm.