Application of Phase Shifting Moire Interferometry to Thermal Strains Measurement of Electronic Packages

Abstract

Phase shifting moire interferometry was developed by using wedged glass plate. This technique was employed to measurement of thermal deformation of electronic package, Stacked-MCP (Multi Chip Package). A thermal loading was applied by heating the devices from room temperature 25℃ to an elevated temperature 100℃. The experimental results showed that large shearing and bending deformations were yielded. The microscopic strain distributions around the chips and resin were quantitatively determined.