Simulation on Chemical Mechanical Polishing using Atomic Force Microscope

Abstract

A model is proposed to estimate the contact force applied to a single particle in a CMP slurry the Greenwood - Williamson contact model. Using this model and the atomic force microscope, the simulation on polishing of the SiO2 by the single particle in CMP slurry is carried out. To verify the validity of the simulation, we perform the estimation of the material removal rate of a SiO2 slurry. As a result, the simulation with this model and AFM test can estimate the material removal rate of real CMP processes.