Abstract
Following the increasing adoption of TFT-type LCD modules in a mobile and other equipments, COG (chip-on-glass) mounting is increasingly employed instead of TCP (tape crrier package) mounting to make LCD modules smaller, thinner, and cheaper. Since the IC and LCD panel electrodes are bonded together by the conductive particles embedded in ACF (anisotoropic conductive film), the bonding conditions depend substantially on the respective characteristics of the IC electrodes and the conductive particles on the ACF. We examined the effects of the arrangement, area and material properties of IC electrodes and the profile and the effects of material properties of conductive ACF particles.
