Abstract
To determine the lifetime of solder joints in chip scale packages we conducted cyclic-bending, heat-cycle, and impact-bending tests. We used Sn-3Ag-0.5Cu solder and Sn-37Pb solder for the evaluation. The cyclic-bending and the heat-cycle tests showed that the lifetime of Sn-3Ag-0.5Cu solder joint was approximately twice that of Sn-37Pb solder joint. On the other hand, in the impact-bending test, the lifetime of Sn-3Ag-0.5Cu joint was shorter than that of Sn-37Pb solder joint due to interfacial crack growth.
