Abstract
Aluminum bonding wires have generally been used for power semiconductor modules. It is necessary to clarify the fatigue strength of bonding wires under thermal cycle conditions in order to design highly reliable modules. Mechanical fatigue tests of actual bonded wires were performed at 26 and 80℃. Fatigue strength and P-S-N curves of Φ300μm wires were obtained in the range of the number of cycles between (10)^2 and (10)^7. It was found that the fatigue life of bonding life of bonding wires was almost independent of the temperature within the limit of practical temperature in use. It was also revealed that effects of wiring forms on fatigue life of bonding wires.
