Strain Distribution Measurement using Digital Image Correlation Method (2) : Verification of Measurement System and its Applications

Abstract

The strain distribution measurement system using digital image correlation method was developed. And the accuracy of the measurement system was verified by the comparison with the strain gage and finite element method (FEM). The results of strain measurement using the system developed by present study were in good agreement with that measured using strain gage and analyzed using FEM. Then the thermal deformation of electronic package was measured using this system .The system using digital image correlation method can provide a reliable evaluation of mechanical reliability for electronic packages.