The proceedings of the JSME annual meeting
Online ISSN : 2433-1325
2004.1
Session ID : 905
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Damage Evolution of Interface between Si_3N_4/Cu Films Using Nano-Scratch Test
Takeshi AKAITadahiro SHIBUTANIQiang YUMasaki SHIRATORI
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
In order to study effect of load velocity on scratch test, scratch test were carried out with three different conditions on two scratch directions with Berkovich indenter. In the case that the edge of indenter was front, damage of interface was observed at 0.4mN〜0.6mN. In another, the critical load was nearly 1.2mN and was not connected with load velocity. In order to elucidate damage evolution of interface, we examined stress distribution on interface by FEM analysis. Stress concentrated on an edge of indenter. Therefore load value to be necessary for damage of interface is different in scratch direction.
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© 2004 The Japan Society of Mechanical Engineers
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