The proceedings of the JSME annual meeting
Online ISSN : 2433-1325
2005.1
Session ID : 1445
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1445 Effects of the Microstructures in a Material on the Thermal Stress under Transient Temperature Changes
Hiroshi SHIBATASotomi ISHIHARATakahito GOSHIMA
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Effects of microstructures and a transient temperature change on the microcracking of both cemented carbides and cermets were analyzed using a simulation method with a triangular elastic spring-lattice model. The transient temperature change was determined to fit the results of the improved thermal shock test which was proposed by Ishihara et al. The simulation results show that the initiations of a microcrack were observed at earlier stages of the transient temperature change for the models of both cemented carbides and cermets. Then, the successive occurrences of the microcracking were strongly affected by the microstructures. In the case of the large number of microcracks, the final number of microcracks for the transient calculation was different from one of a single step calculation.
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© 2005 The Japan Society of Mechanical Engineers
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