The proceedings of the JSME annual meeting
Online ISSN : 2433-1325
2005.1
Session ID : 1454
Conference information
1454 Study of Thermal Analysis for Lap Join
Shuutei SASAKITsutomu EZUMI
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
The bond joints are used in the various environments, and the indispensability for the industrial society. This is done under the high temperature, the normal temperature and the low temperature, the behavior of the stress in these conditions changes. In the case of the thermal experimental analysis, this has to consider the temperature of the environment. The authors made the new architect system for the purpose of the thermal experimental analysi. This is keeping at the constant temperature that is indicated, the specimen is doing at the same temperature. This is the experiments that is reproduced the same environment at the same temperature. This system is able to carried out the various temperature, the good result from this new system was able to get.
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© 2005 The Japan Society of Mechanical Engineers
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